Call for papers open In person

Semiconductor Packaging and Thermal Management Conference in Kisumu, Kenya – January 2027

Official name: International Conference on Semiconductor Packaging and Thermal Management (ICSPTM)

Jan 11, 2027 Kisumu, Kenya
Abstract deadline December 10, 2026
29days
–hours
–min
Submit on the conference website
DatesJan 11, 2027
Abstract deadlineDec 10, 2026
Organized byFlexz Conferences
Event ID1493199

About this conference

This semiconductors conference takes place in Kisumu, Kenya on Jan 11, 2027. Abstracts and papers are due by December 10, 2026. It is one of 199 upcoming conferences in Kenya; the next one after it starts on January 11. It is organized by Flexz Conferences.

Visit the conference website for the programme, fees and how to submit a paper.

Topics

Semiconductors Engineering

Key dates

  1. Abstract deadline · Dec 10, 202629 days left
  2. Conference · Jan 11, 2027Kisumu, Kenya

Details come from the organizer. Please check dates, fees and venue on the conference website before you register or travel.

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